Thermal Modeling and Simulation
The PLECS Conference is coming back in 2024 with insights into simulating thermal behavior of power semiconductors. The speakers are various users of PLECS from industry, research, and academia. In the exhibition, engineers of semiconductor manufacturers will be ready for discussion. The two-day event will also provide plenty of networking opportunities with all participants. The participation fee will be 700.00 Euros or Swiss Francs (incl. 7.7% VAT).
The conference language will be English. As this is an on-site only event, there will be no virtual replacement. The Plexim staff is excited to welcome you in Zurich, on March 12 and 13, 2024! Please see the registration form linked below "Conference_Registration_2024".
Interested to join as exhibitor or speaker? Contact us at email@example.com.
Impressions of the previous PLECS Conference:
To Be Announced
Please send your completed registration form via email to firstname.lastname@example.org or via fax to +41 44 533 51 01