PLECS熱設定ファイル

下記表はPLECS用半導体熱損失モデルを配布している半導体メーカーです:

企業名 デバイス種類 リンク/連絡先
Cambridge GaN Devices ICeGaN HEMTs (CGD65A055S2 available, more to be supported) Link
Dynex IGBTs, fast recovery diodes Link
Efficient Power Conversion (EPC) GaN MOSFETs Contact info@plexim.com for support.
Fuji Electric IGBT modules Contact info@plexim.com for support.
GaN Systems (Infineon) GaN MOSFETs Link
GeneSiC (Navitas) SiC MOSFETs, diodes Link
Hitachi Energy (ABB) IGBT insulated modules Link
IGBT press-pack modules Link
IGCTs Link
fast recovery diodes Link
RoadPak SiC e-mobility modules Link
Hitachi Power Semiconductors Various IGBT, SiC modules Contact info@plexim.com for support.
Infineon Various Power Devices Link
Microchip (Microsemi) SiC MOSFETs, diodes Link
onsemi SiC MOSFETs, diodes, modules Link (models available in EliteSiC)
quorvo (UnitedSiC) SiC MOSFETs Link (click "Design Files" for a device)
SiC Schottky diodes Link (click "Design Files" for a device)
Rohm Semiconductor Field stop trench IGBTs Link
SiC power modules Link
SiC MOSFETs Link
Semikron Danfoss IGBT and SiC modules Link
Texas Instruments GaN ICs Link (bottom of product pages)
Vincotech Power modules Link (see "PLECS support" section)
Wolfspeed SiC MOSFETs, modules, diodes Link