RT Box 3

Doubled I/Os for Multi-Level Applications

HIL simulations of multi-level converters usually require a high number of digital gate signals and analog sensor measurements. The RT Box 3 is ideal for such multi-level applications because it provides twice as many analog and digital I/Os as the RT Box 2. Otherwise, the specifications are identical to those of the RT Box 2, including a pair of Nanostep® solver units.

For even larger systems, several RT Boxes can be easily coupled via high-speed serial interconnects.

Technical Specifications

Processor Xilinx Zynq Ultrascale+ ZU9EG
  CPU cores 4 x ARM Cortex-A53, 1.5 GHz
Nanostep® solver Units 2
  Step size 4 ns
Analog inputs Channels 32
  Resolution 16 bit, simultaneous sampling
  Voltage ranges -10 ... 10 V
  -5 ...   5 V
  Input type Differential
  Max. sample rate 5 Msps
  Input impedance 1 MΩ, 24 pF
  Connector D-SUB 37 pin male
Analog outputs Channels 32
  Resolution 16 bit, simultaneous update
  Voltage ranges -10 ... 10 V
    0 ... 10 V
  -5 ...   5 V
    0 ...   5 V
  Max. update rate 5 Msps
  Output impedance 0 Ω
  Max. output current 10 mA
  Connector D-SUB 37 pin female
Digital inputs Channels 64
  Logic levels 3.3 V (5 V tolerant)
  Connector D-SUB 37 pin male
Digital outputs Channels 64
  Logic levels 3.3 V
5 V
  Connector D-SUB 37 pin female
Resolver Input/Output 2/2
  Connector D-SUB 9 pin male/fem.
I/O protection Short-circuit Permanent
  Overvoltage -24 ... 24 V
Connectivity Gigabit Ethernet 2
  SFP+ interconnects
6.25 Gbps per lane		 8
  Industrial Ethernet 2 (EtherCAT)
  CAN bus 2
  RS 232/422/485 2
  USB A 3.0 1
  DisplayPort 1
Storage Internal SSD 480 GB
  Firmware SD card
Power supply
(internal)		 100 ... 240 Vac
50 ... 60 Hz		 100 VA
Size (mm) Depth x Width 310 x 250
  Height 145

Technical specifications of all RT Boxes in comparison.